Electronic part and its manufacturing method

ABSTRACT

An electronic part comprising: a functional element chip on which a functional element has been formed; a wiring member which is electrically connected to the functional element chip; and a protecting member for protecting the functional element chip, wherein the wiring member has a stair shape and is electrically connected to the functional element chip, so that an electronic part having a functional element chip which is hard to be distorted.  
     An electronic part comprising: a functional element chip on which a functional element has been formed; and a protecting member for protecting the functional element chip, wherein a spacer is sandwiched between the functional element chip and the protecting member, so that a constant gap between a functional element chip and a protecting cap is easily held.

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The invention relates to an electronic part such as solid stateimage pick-up apparatus, light emitting apparatus, display apparatus, orthe like and to a manufacturing method of such an electronic part. Moreparticularly, the invention relates to an electronic part comprising aterminal of a functional element chip, a wiring member which iselectrically connected to the terminal, and an adhesive material foradhering the functional element chip and a protecting member and to amanufacturing method of such an electronic part.

[0003] 2. Related Background Art

[0004] Hitherto, as a kind of electronic part, an apparatus such thatlight information can be converted into an electric signal, the electricsignal can be converted into the light information, light can be emittedor modulated by the electric signal, or an optical path can be changedby the electric signal has been known. An apparatus having functionalelements has been known as such a kind of apparatus. As functionalelements, a photosensitive element, a light emitting element, a DMD(Digital Micromirror Device), and the like have been known.

[0005] Among them, a solid state image pick-up apparatus having aphotosensitive element array will be explained as an example of theelectronic part. The solid state image pick-up apparatus is oftenprovided in an image inputting apparatus such as video camera, digitalstill camera, or the like. According to such a solid state image pick-upapparatus, a photodiode serving as a photosensitive element, a CCDserving as a drive reading circuit, a CMOS, and the like are integratedon a semiconductor substrate such as a silicon wafer or the like, anintegrated circuit is formed, and thereafter, a color filter and amicrolens are formed above an image pick-up area (effective pixel area)by using an acrylic material or the like.

[0006] The silicon wafer on/over which the integrated circuit, colorfilter, and microlens have been formed is cut by performing a dicingprocess so as to obtain a chip. The resultant chip is enclosed in aceramics package or the like. The chip and leads are electricallyconnected by a wire-bonding process or the like. After that, aprotecting cap of a glass substrate is adhered onto the package, therebyprotecting the chip against the ambient atmosphere.

[0007] In recent years, miniaturization of the image inputting apparatussuch as a digital camera or the like has been progressed. Thus, it isalso demanded to miniaturize and thin the solid state image pick-upapparatus. For example, the method of miniaturizing the solid stateimage pick-up apparatus has been disclosed in JP-A-7-099214.

[0008]FIG. 15 is a cross sectional view of a solid state image pick-upapparatus as an example of the conventional electronic parts. In FIG.15, reference numeral 1 denotes a solid state image pick-up elementchip; 2 a solid state image pick-up element; 3 a protecting cap; 4 a TAB(Tape-Automated Bonding) tape serving as a wiring and constructed by aninsulative film 41 and a beam lead 42; 5 an electrode pad; 6 a bump; 11an adhesive material; 12 an anisotropic conductive adhesive material;and 13 a sealing resin.

[0009] According to the solid state image pick-up apparatus shown inFIG. 15, first, the protecting cap 3 and TAB tape 4 are adhered via thelight transparent adhesive material 11. The electrode pad 5 is formed onthe solid state image pick-up element chip 1 having the solid stateimage pick-up element 2 and a microlens (not shown). Further, the bump 6is formed on the electrode pad 5. The anisotropic conductive adhesivematerial 12 is coated onto the bump 6 and its peripheral areas by adispenser or the like. The TAB tape 4 adhered to the protecting cap 3 bythe adhesive material 11 is positioned to the solid state image pick-upelement chip 1 and, thereafter, the bump 6 and TAB tape 4 arethermo-compression bonded. Thus, the solid state image pick-up apparatusshown in FIG. 15 is obtained.

[0010] Manufacturing steps of the conventional electronic part will bedescribed with reference to FIGS. 16A to 16C. As an example of theelectronic parts, the manufacturing steps of a prior art in which a gapbetween the solid state image pick-up element chip 1 and protecting cap3 is held to be constant are shown here.

[0011] First, in FIG. 16A, reference numeral 13 denotes the solid stateimage pick-up element fixing tool; 14 a protecting cap holding tool; and15 a gap control pin.

[0012] An explanation of the component elements having the samereference numerals as those described already is omitted here.

[0013] First, as shown in FIG. 16A, the solid state image pick-upelement chip 1 to which the TAB tape 4 is electrically connected throughthe electrode pad 5 and bump 6 is put on the solid state image pick-upelement fixing tool 13. The protecting cap 3 is fixed to the protectingcap holding tool 14. The gap control pin 15 is attached to theprotecting cap holding tool 14.

[0014] Subsequently, as shown in FIG. 16B, the solid state image pick-upelement fixing tool 13 and protecting cap holding tool 14 are overlaid.At this time, the gap control pin 15 is come into contact with the solidstate image pick-up element fixing tool 13 and the gap between the solidstate image pick-up element chip 1 and protecting cap 3 is controlled.

[0015] In this state, as shown in FIG. 16C, outer peripheral portions ofthe solid state image pick-up element chip 1 and protecting cap 3 aresealed by a sealing resin 9.

[0016] (Technical problem 1)

[0017] However, in the solid state image pick-up apparatus shown in FIG.15, if a coefficient of thermal expansion of the solid state imagepick-up element chip 1 and that of the protecting cap 3 are different, adistortion occurs in the solid state image pick-up element chip 1 due toheating in the manufacturing steps or due to a temperature change whichis caused when the apparatus is used, or since a pressure of the air inthe package changes due to the temperature change which is caused whenthe apparatus is used, a distortion occurs in the solid state imagepick-up element chip 1. If the distortion occurs in the solid stateimage pick-up element chip 1, a focal position differs every pixel ofthe solid state image pick-up element 2 and picture qualitydeteriorates. In addition, there is also a case where the TAB tape 4 ispeeled from the bump 6 due to a stress by such a distortion and theelectric connection between the TAB tape 4 and solid state image pick-upelement chip 1 is disconnected. Further, there is also a case where aphenomenon such that the protecting cap 3, adhesive material 11, TABtape 4, and anisotropic conductive adhesive material 12 are peeled fromeach interface of the sealing resin 13 occurs.

[0018] (Technical problem 2)

[0019] In the manufacturing steps of the solid state image pick-upapparatus shown in FIGS. 16A to 16C, since the control of the gapbetween the solid state image pick-up element chip 1 and protecting cap3 is largely influenced by a variation of a glass thickness, a variationof a chip thickness, or precision of the tool, the gap cannot beaccurately controlled. Specifically speaking, according to theconventional gap control using the gap control pin 15, although the gapbetween an upper surface of the protecting cap 3 (surface which does notface the solid state image pick-up element chip) and a lower surface ofthe solid state image pick-up element chip 1 (surface which does notface the protecting cap) is controlled, the gap between the surfaces ofthe protecting cap 3 and solid state image pick-up element chip 1, thatis, the gap between the surfaces which face each other is notcontrolled. Therefore, if there is (are) a variation (variations) of theglass thickness or/and the chip thickness, the gap between the surfacesof the solid state image pick-up element chip 1 and protecting cap 3which face each other cannot be held to be constant, so that a variationoccurs. Consequently, reliability of the electric connection between theTAB tape 4 and solid state image pick-up element chip 1 cannot beassured. Thus, optical characteristics of the solid state image pick-upelement 2 are adversely influenced. On the other hand, if it is intendedto adhere the solid state image pick-up element chip 1 and protectingcap 3 while keeping the gap between the surfaces of them which face eachother at high precision, high precision is required in a laminatingapparatus, its construction becomes complicated, and the apparatuseventually becomes expensive.

[0020] It is, therefore, an object of the invention to improve electricreliability of an electronic part and cheaply provide an electronicpart.

[0021] Another object of the invention is to provide a cheap electronicpart of high reliability while keeping a constant interval between afunctional element chip and a protecting member.

[0022] In the specification, the gap between the surfaces of the solidstate image pick-up element chip 1 and protecting cap 3 which face eachother is simply referred to as a “gap” hereinbelow.

[0023] In the specification, the stress which causes a differencebetween the coefficients of thermal expansion of the solid state imagepick-up element chip 1 and protecting cap 3 is simply referred to as a“stress” hereinbelow.

SUMMARY OF THE INVENTION

[0024] To solve the technical problem 1, therefore, it is an object ofthe invention to provide an electronic part having a functional elementchip which is hard to be distorted.

[0025] To solve the technical problem 1, therefore, it is another objectof the invention to provide an electronic part in which an electricconnection between a functional element chip and a wiring member is hardto be disconnected.

[0026] To accomplish the object regarding the technical problem 1,according to the invention, there is provided an electronic partcomprising: a functional element chip on which a functional element hasbeen formed; a wiring member which is electrically connected to thefunctional element chip; and a protecting member for protecting thefunctional element chip, wherein the wiring member has a stair shape andis electrically connected to the functional element chip.

[0027] To accomplish the object regarding the technical problem 1,according to the invention, there is provided a manufacturing method ofan electronic part having a functional element chip on which afunctional element has been formed, a wiring member which iselectrically connected to the functional element chip, and a protectingmember for protecting the functional element chip, comprising the stepsof: electrically connecting the functional element chip and the wiringmember; and adhering the protecting member and the wiring member byusing an adhesive material so as to have a stair shape.

[0028] To solve the technical problem 2, therefore, it is an object ofthe invention to provide a cheap electronic part with high reliabilityin which a constant gap between a functional element chip and aprotecting cap is easily held.

[0029] To accomplish the object regarding the technical problem 2,according to the invention, there is provided an electronic partcomprising: a functional element chip on which a functional element hasbeen formed; and a protecting member for protecting the functionalelement chip, wherein a spacer is sandwiched between the functionalelement chip and the protecting member.

[0030] To accomplish the object regarding the technical problem 2,according to the invention, there is provided a manufacturing method ofan electronic part having a functional element chip on which afunctional element has been formed and a protecting member forprotecting the functional element chip, comprising the steps of: coatinga resin serving as a spacer onto the functional element chip or theprotecting member; and curing the coated resin.

BRIEF DESCRIPTION OF THE DRAWINGS

[0031]FIG. 1A is a top plan view of a solid state image pick-upapparatus as an electronic part according to the first embodiment of theinvention;

[0032]FIG. 1B is a cross sectional view taken along the broken line1B-1B in FIG. 1A;

[0033]FIG. 1C is a cross sectional view taken along the broken line1C-1C in FIG. 1A;

[0034]FIG. 2 is a schematic cross sectional view of a solid state imagepick-up apparatus as an electronic part according to the secondembodiment of the invention;

[0035]FIG. 3 is a schematic cross sectional view of a solid state imagepick-up apparatus as an electronic part according to the thirdembodiment of the invention;

[0036]FIG. 4 is a schematic cross sectional view of a solid state imagepick-up apparatus as an electronic part according to the fourthembodiment of the invention;

[0037]FIG. 5 is a schematic cross sectional view of a solid state imagepick-up apparatus as an electronic part according to the fifthembodiment of the invention;

[0038]FIG. 6 is a schematic cross sectional view of a solid state imagepick-up apparatus as an electronic part according to the sixthembodiment of the invention;

[0039]FIGS. 7A, 7B, 7C, 7D, and 7E are step diagrams showing amanufacturing method of the solid state image pick-up apparatus as anelectronic part according to the invention;

[0040]FIGS. 8A and 8B are step diagrams showing a manufacturing methodof the solid state image pick-up apparatus as an electronic partaccording to the invention;

[0041]FIG. 9A is a top plan view of a solid state image pick-upapparatus as an electronic part according to the seventh embodiment ofthe invention;

[0042]FIG. 9B is a cross sectional view taken along the broken line9B-9B in FIG. 9A;

[0043]FIG. 9C is a cross sectional view taken along the broken line9C-9C in FIG. 9A;

[0044]FIGS. 10A, 10B, and 10C are step diagrams showing a manufacturingmethod of the electronic part according to the seventh embodiment of theinvention;

[0045]FIGS. 11A and 11B are diagrams showing another example of anarrangement of resin spacers in FIG. 9;

[0046]FIG. 12A is a top plan view of a solid state image pick-upapparatus as an electronic part according to the eighth embodiment ofthe invention;

[0047]FIG. 12B is a cross sectional view taken along the broken line12B-12B in FIG. 12A;

[0048]FIG. 12C is a cross sectional view taken along the broken line12C-12C in FIG. 12A;

[0049]FIGS. 13A, 13B, 13C, 13D, 13E, and 13F are step diagrams showing amanufacturing method of the solid state image pick-up apparatus as anelectronic part of the invention;

[0050]FIG. 14 is a constructional diagram of a solid state image pick-upsystem in the ninth embodiment of the invention;

[0051]FIG. 15 is a cross sectional view of a solid state image pick-upapparatus as a conventional electronic part; and

[0052]FIGS. 16A, 16B, and 16C are step diagrams showing a manufacturingmethod of the solid state image pick-up apparatus as a conventionalelectronic part.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0053] Embodiments of the present invention will now be describedhereinbelow with reference to the drawings.

[0054] (Embodiment 1)

[0055]FIG. 1A is a top plan view of a solid state image pick-upapparatus as an electronic part according to the embodiment 1 of theinvention.

[0056]FIG. 1B is a cross sectional view taken along the broken line1B-1B in FIG. 1A.

[0057]FIG. 1C is a cross sectional view taken along the broken line1C-1C in FIG. 1A.

[0058] In the electronic part, reference numeral 1 denote the functionalelement chip; 2 the functional element formed on the functional elementchip; 3 the protecting member for protecting the functional elementchip; and 4 the wiring member electrically connected to the functionalelement chip 1.

[0059] In the present specification, a region where the TAB tape 4 andsolid state image pick-up element chip 1 are electrically connected isreferred to as a “connecting region”, and a region where the TAB tape 4and protecting cap 3 are adhered is referred to as an “a adhesiveregion”.

[0060] Hereinafter, in the specification, a direction of a plane of thesolid state image pick-up element chip 1 on which the solid state imagepick-up element 2 has been mounted is referred to as a “horizontaldirection”, on the other hand, a vertical direction is simply referredto as a “vertical direction” as compared with the horizontal direction.

[0061] As will be explained in detail hereinbelow, in the embodiment,explanation will be made with respect to the solid state image pick-upapparatus as an example of the electronic parts. As a functional elementchip 1, for example, the solid state image pick-up element chip 1 inwhich a plurality of photoelectric converting elements and a microlens(which are not shown) have been formed can be used. The bump 6 made ofgold or the like is provided as a terminal. Reference numeral 4 denotesthe TAB (Tape-Automated Bonding) tape in which the gold-platedconductive beam lead 42 made of nickel alloy, copper, or the like isprovided on the insulative tape film 41 consisting of polyimide as amain component as a wiring member. Further, reference numeral 3 denotesthe light transparent protecting cap serving as a protecting member forprotecting the solid state image pick-up element chip 1 in theembodiment. The protecting cap 3 is arranged on the side of the solidstate image pick-up element chip 1 where the solid state image pick-upelement 2 has been formed. The protecting cap 3 is made of a plate-likeglass which transmits the light, for example, no-alkali glass, quartz,or the like. A protecting cap made of a transparent resin, for example,acryl can be also used. As a protecting cap 3, a reflection preventingfilm, an optical low pass filter, or an infrared cutting filter can besolely laminated onto the protecting cap 3 or they can be combined andlaminated thereon as necessary. Reference numeral 7 denotes a lightshielding member (light shielding mask) made of a light absorber such asblack epoxy resin or the like formed in the peripheral portion of theprotecting cap 3, for example, on the side of the solid state imagepick-up element chip 1. The light shielding member 7 is provided at aperiphery so as to cover the bump 6 and copper lead 42 in order toprevent a situation such that the incident light is irregularlyreflected or the like by the bump 6 and beam lead 42, so that theunnecessary light enters the solid state image pick-up element 2 andexercises an adverse influence on an image. Reference numeral 9 denotesthe sealing resin as a sealing material. The sealing resin 9 hasflexibility and is made of, for example, an urethane system, siliconesystem, styrene system, ester system, vinyl chloride system, epoxysystem, or the like.

[0062] In the invention, it is preferable that the sealing resin 9 hasflexibility. This is because if the sealing resin 9 itself hasflexibility, the stress can be lessened. Therefore, the resin of theepoxy system, or the like is modified in the embodiment, the resin 9which is compounded of plasticizers or elastomers is used.

[0063] It is preferable that an elastic modulus of the sealing resin 9is equal to or less than 300 MPa. This is because if the elastic modulusis equal to or less than 300 MPa, the flexibility which can lessen thestress can be obtained.

[0064] More preferably, it is desirable that the elastic modulus of thesealing resin 9 is set to a value that is optimized so as to lessen thestress which is applied to the solid state image pick-up element chip 1.In the embodiment, the resin having an elastic modulus of, for example,about 150 MPa is used.

[0065] In this embodiment, the sealing resin 9 is formed to cover thebeam lead 42 of the TAB tape 4 at a place near the connecting region andto surround the whole periphery of the solid state image pick-up elementchip 1 lest the beam lead 42 is exposed. By surrounding the wholeperiphery as mentioned above, air-tightness of a space between the solidstate image pick-up element chip 1 and protecting cap 3 is held, so thatin addition to an effect of shutting off the light, moisture resistanceof the electronic part can be also improved. But, if electronic part isnot necessary to have an air-tightness or doesn't have to shut off thelight or moisture resistance doesn't matter, a plurality of sealingresins 9 can be discretely formed at a plurality of positions along theperiphery of the solid state image pick-up element chip 1 or it is notalways necessary to form the sealing resin 9.

[0066] The TAB tape 4 as a wiring member has a stair shape. Specificallyspeaking, assuming that the plane of the solid state image pick-upelement chip 1 on which the solid state image pick-up element 2 has beenformed is used as a reference of height, the connecting region of theTAB tape 4 and the adhesive region of the TAB tape 4 are formed so as tohave different heights.

[0067] The wiring member is adhered to the protecting cap 3 by a liquidtype adhesive material or an adhesive material sheet 8 is used as anadhesive material.

[0068] In this embodiment an adhesive material sheet 8 is used as anadhesive material. The adhesive material sheet 8 is made of athermoplastic resin, a thermo-setting resin, or their mixed resin. As anexample of an adhering method using the mixed resin, the resin in aninitial state is a solid instead of a liquid by using characteristics ofthe thermoplastic resin and temporarily adhered onto one of the membersto be adhered at a low temperature. Subsequently, the other member to beadhered is laminated and, in this state, the resin is actually adheredat a high temperature by using characteristics of the thermo-settingresin.

[0069] The thermo-setting resin is used in the embodiment.

[0070] By using such a sheet-like adhesive material as mentioned above,the thickness can be easily controlled and an overflow of theunnecessary adhesive material can be prevented.

[0071] Further, by fixing the resin by using a curing-type adhesivematerial, if a mechanical stress is applied to the wiring member fromthe outside, the stress is received in the adhesive region, so that thestress from the outside is hardly transferred to the connecting region.Consequently, the electrical connection is hardly disconnected.

[0072] Therefore, it is desirable that the sealing resin has theflexibility and the adhesive material is the curing-type material. Inother words, it is preferable that the elastic modulus of the sealingresin is lower than that of the adhesive material.

[0073] In the embodiment, the adhesive region is provided on the baseedge portion side of the TAB tape 4 closer than the connecting region.

[0074] The stair shape in the embodiment will be further described indetail. Referring to FIG. 1B, assuming that the direction of the surfaceof the solid state image pick-up element chip 1 on which the solid stateimage pick-up element 2 has been formed is set to the horizontaldirection, such a stair shape is a shape in which the TAB tape 4 whichwires the connecting region and the adhesive region is arranged in thedirection perpendicular to the horizontal direction.

[0075] Hitherto (for example, FIG. 15), since the connecting region andthe adhesive region are formed in the same region of the TAB tape 4 inthe front edge portion of the TAB tape 4, the stress which is causedbecause the coefficient of thermal expansion of the protecting cap 3 isdifferent from that of the solid state image pick-up element chip 1 istransferred to the connecting region without being lessened. There is,consequently, a problem such that the solid state image pick-up elementchip 1 is distorted or the TAB tape 4 and bump 6 are peeled off.According to the embodiment, such a problem is solved by a methodwhereby the TAB tape 4 is formed in a stair shape and the connectingregion and the adhesive region are physically away from each other,thereby lessening the stress due to expansion/contraction performance ofthe TAB tape 4 between the adhesive region and the connecting region.

[0076] As described above, the electronic part of the invention ischaracterized in that the distortion of the functional element chip isdifficult to occur.

[0077] In addition, the electronic part of the invention ischaracterized in that the wiring member and the functional element chipare difficult to be peeled off.

[0078] The electronic part of the invention is characterized in that incase of using the curing-type and high elastic modulus adhesive materialas an adhesive material, even if a stress is applied to the wiringmember from the outside, the wiring member and the functional elementchip are difficult to be peeled off.

[0079] (Embodiment 2)

[0080]FIG. 2 is a schematic cross sectional view of a solid state imagepick-up apparatus as an electronic part according to the embodiment 2 ofthe invention.

[0081] Explanation regarding the component elements designated by thesame reference numerals as those of the component elements which havealready been described above is omitted here.

[0082] The embodiment 2 differs from the embodiment 1 with respect tothe stair shape of the TAB tape 4. Specifically speaking, thoseembodiments are the same with respect to a point that assuming that thesurface of the solid state image pick-up element chip 1 on which thesolid state image pick-up element 2 has been formed is set to thereference of the height, the connecting region of the TAB tape 4 and theadhesive region of the TAB tape 4 are formed so as to have the differentheights in a manner similar to the embodiment 1. Those embodiments aredifferent with respect to the following point. That is, in theembodiment 1, the TAB tape 4 between the connecting region and theadhesive region is wired in the vertical direction. However, in theembodiment 2, since the connecting region and the adhesive region arearranged at the different positions regarding the horizontal direction,the wiring between them is arranged in an oblique direction other thanthe vertical direction.

[0083] By setting such a stair shape, for example, when a stress isapplied from the outside to the solid state image pick-up element chip 1in the vertical direction or the oblique direction, since the stress canbe distributed in the vertical direction and the horizontal direction,the solid state image pick-up element chip 1 is hard to be distorted.Therefore, the shape in the embodiment 2 is more preferable than that inthe embodiment 1 with respect to a point that the stress from theoutside can be lessened.

[0084] Further, also with respect to the stress which is caused due tothe difference between the coefficients of thermal expansion of thesolid state image pick-up element chip 1 and protecting cap 3, ascompared with the TAB tape 4 in which the connecting region and theadhesive region is wired in the vertical direction as in the embodiment1 and which has the stair shape of the same height as that in theembodiment 1, according to the embodiment 2, the physical distance ofthe TAB tape 4 between the connecting region and the adhesive region islonger than that of the TAB tape 4 in the embodiment 1 by a distancecorresponding to the portion between the connecting region and theadhesive region arranged in the oblique direction. Therefore, theexpansion/contraction performance is improved and the further largestress can be lessened.

[0085] In the embodiment 2, the adhesive region is provided on the baseedge portion side of the TAB tape 4 closer than the connecting region.

[0086] (Embodiment 3)

[0087]FIG. 3 is a schematic cross sectional view of a solid state imagepick-up apparatus as an electronic part according to the embodiment 3 ofthe invention.

[0088] Explanation regarding the component elements designated by thesame reference numerals as those of the component elements which havealready been described above is omitted here.

[0089] The embodiment 3 differs from the embodiments 1 and 2 withrespect to a point that the TAB tape 4 does not have the stair shape.

[0090] Specifically speaking, assuming that the surface of the solidstate image pick-up element chip 1 on which the solid state imagepick-up element 2 has been formed is set to a reference of the height,the connecting region of the TAB tape 4 and the adhesive region of theTAB tape 4 are formed so as to have the same height. Further, at a frontedge portion of the TAB tape 4, a connecting region with the solid stateimage pick-up element chip 1 is formed. An adhesive region with theprotecting cap 3 is formed on the base edge portion side closer than thefront edge portion of the TAB tape 4. In the embodiment 3, a flexibleresin is used as a sealing resin 9 and a curing-type adhesive materialis used as an adhesive material.

[0091] Therefore, unlike the conventional construction (for example,FIG. 15), the connecting region and the adhesive region of the TAB tape4 are not formed in the same region on the TAB tape 4. That is, sincethe connecting region and the adhesive region are formed so as to bephysically away from each other, the stress can be lessened by the TABtape 4 provided between them.

[0092] (Embodiment 4)

[0093]FIG. 4 is a schematic cross sectional view of a solid state imagepick-up apparatus as an electronic part according to the embodiment 4 ofthe invention.

[0094] Explanation regarding the component elements designated by thesame reference numerals as those of the component elements which havealready been described above is omitted here.

[0095] The embodiment 4 differs from the embodiments 1 and 2 withrespect to a stair shape of the TAB tape 4.

[0096] Specifically speaking, according to the embodiment 1, the TABtape 4 is arranged in the vertical direction at the shortest distancefrom the connecting region to the adhesive region. In the embodiment 4,the TAB tape 4 longer than the shortest distance is arranged between theconnecting region and the adhesive region.

[0097] Further explaining in detail, in the embodiments 1 and 2, thestress is lessened by the expansion/contraction performance which theTAB tape 4 itself has. However, according to the embodiment 4, by wiringthe adhesive region and the connecting region by the TAB tape 4 longerthan the shortest distance, the stress can be lessened by stretching thesurplus TAB tape 4. Therefore, a structure such that the stress isfurther difficult to be transferred to the connecting region isobtained. Even if the surplus TAB tape 4 is fully stretched, the stresscan be further lessened by the expansion/contraction performance whichthe TAB tape 4 itself has.

[0098] Also in the embodiment 4, the adhesive region is provided on thebase edge portion side of the TAB tape 4 closer than the connectingregion in a manner similar to other embodiments.

[0099] As described above, according to the embodiment 4, the stresswhich is further larger than those in the embodiments 1 and 2 can belessened and the electronic part in which the functional element chip isdifficult to be distorted can be provided.

[0100] In addition, the electronic part in which the electric connectionof the wiring member and the functional element chip is difficult to bepeeled off can be provided.

[0101] (Embodiment 5)

[0102]FIG. 5 is a schematic cross sectional view of a solid state imagepick-up apparatus as an electronic part according to the embodiment 5 ofthe invention.

[0103] Explanation regarding the component elements designated by thesame reference numerals as those of the component elements which havealready been described above is omitted here.

[0104] The embodiment 5 differs from the embodiment 4 with respect tothe stair shape of the TAB tape 4. Specifically speaking, according tothe embodiment 4, as a TAB tape 4 which is wired in the verticaldirection from the connecting region to the adhesive region at theshortest distance, the TAB tape 4 longer than the shortest distance isused. In the embodiment 5, as a TAB tape 4 which is wired in the obliquedirection from the connecting region to the adhesive region at theshortest distance, the TAB tape 4 longer than the shortest distance isused.

[0105] Further explaining, the connecting region and the adhesive regionare formed at different positions with respect to the horizontaldirection, that is, at positions which are away from each other.

[0106] Further explaining in detail, according to the embodiment 5, theadhesive region is provided on the base edge portion side of the TABtape 4 closer than the connecting region.

[0107] Further explaining more in detail, according to the stair shapeof the TAB tape 4 in the embodiment 5, when a stress if applied from theoutside to the solid state image pick-up element chip 1 in the verticaldirection or oblique direction, since the stress can be distributed inthe vertical direction and the oblique direction, the solid state imagepick-up element chip 1 is difficult to be distorted. Thus, the stairshape of the embodiment 5 is more preferable in terms of a point thatthe stress from the outside can be lessened more than that case in theembodiment 4.

[0108] According to the embodiment 5, since the connecting region andthe adhesive region are wired by the TAB tape 4 longer than the shortestdistance in a manner similar to the embodiment 4, the stress which isfurther larger than those in the embodiments 1 and 2 can be lessened.

[0109] (Embodiment 6)

[0110]FIG. 6 is a schematic cross sectional view of a solid state imagepick-up apparatus as an electronic part according to the embodiment 6 ofthe invention.

[0111] Explanation regarding the component elements designated by thesame reference numerals as those of -the component elements which havealready been described above is omitted here.

[0112] According to the embodiment 6, in a manner similar to theembodiments 4 and 5, as a TAB tape 4 which is wired between theconnecting region and the adhesive region, the TAB tape 4 longer thanthe shortest distance is used.

[0113] The embodiment 6 differs from the embodiments 4 and 5 withrespect to the stair shape of the TAB tape 4. Specifically speaking,according to the embodiments 1, 2, 4, and 5, when the surface of thesolid state image pick-up element chip 1 on which the solid state imagepick-up element 2 has been formed is assumed to be the reference of theheight, the connecting region of the TAB tape 4 and the adhesive regionof the TAB tape 4 are formed so as to have the different heights. On theother hand, according to the embodiment, the connecting region of theTAB tape 4 and the adhesive region of the TAB tape 4 are formed so as tohave the same height with respect to the vertical direction, and the TABtape 4 forms the stair shape between the connecting region and theadhesive region. That is, the connecting region and the adhesive regionare wired by the TAB tape 4 longer than the shortest distance.

[0114] Therefore, if the distance between the connecting region and theadhesive region in the horizontal direction in the embodiment 3 is thesame as that in the embodiment 6, since the surplus TAB tape 4 canlessen the stress according to the embodiment 6, the stress can belessened more than that in the embodiment 3.

[0115] Further, different from the embodiments 1, 2, 4, and 5, accordingto the embodiment 6, since the connecting region and the adhesive regionare formed so as to have the same height from the solid state imagepick-up element chip 1 with respect to the vertical direction, thethickness interval between the solid state image pick-up element chip 1and protecting cap 3 can be made further thin.

[0116] Therefore, in addition to features such that the distortion ofthe functional element chip is hard to occur and the wiring member andthe functional element chip are difficult to be peeled off, theminiaturized electronic part can be provided.

[0117] The manufacturing method of the electronic part of the inventionwill be described.

[0118]FIGS. 7A to 7E are schematic cross sectional views for explainingan outline of the manufacturing method of the electronic part of theinvention.

[0119]FIGS. 8A and 8B are schematic cross sectional views for explainingin detail manufacturing steps of forming a wiring member of anelectronic part according to the invention is formed in a stair shape.

[0120] The same solid state image pick-up apparatus as that shown inFIG. 2 will be explained further in detail as an example.

[0121] First, as shown in FIG. 7A, the solid state image pick-up elementchip 1 as a functional element chip and the protecting cap 3 as aprotecting member 3 are prepared and, further, the solid state imagepick-up element chip 1 and protecting cap 3 mentioned above are arrangedwith an interval therebetween.

[0122] Subsequently, the solid state image pick-up element chip 1 inwhich a microlens has been formed although it is not shown isconstructed in a manner such that the solid state image pick-up element2 serving as a functional element is formed on the surface which facesthe protecting cap 3, the electrode pad 5 is further formed in theregion which exists in the same surface as that mentioned above and inwhich the solid state image pick-up element 2 is not formed, and thebump 6 as a terminal is further formed on the solid state image pick-upelement chip 1 via the electrode pad 5. As a forming method of the bump6, for example, a stud bump method, a plating method, or the like isused.

[0123] Subsequently, the light shielding film 7 having a thickness ofabout 30 μm is formed onto the surface (on the side which faces thesolid state image pick-up element chip 1) of the protecting cap 3obtained by cutting, for example, a transparent glass substrate andchamfering the cut surface. The light shielding film 7 for shielding thelight is made of a metal film or resin film. In case of the metal film,the film 7 is formed by using a sputtering method, an evaporationdepositing method, or the like. In case of the resin film, it is formedby using a printing method, a dispensing method, or the like.

[0124] Subsequently, FIG. 7B will be described. The TAB tape 4 as awiring member is constructed by the insulative film 41 and beam lead 42.

[0125] In the manufacturing step of FIG. 7B, the bump 6 and the beamlead 42 of the TAB tape 4 are electrically connected by an ultrasonicbonding method or the like while having a stair shape.

[0126] An example of the manufacturing step of forming the TAB tape 4 soas to have a stair shape will now be specifically explained withreference to FIGS. 8A and 8B.

[0127] Reference numeral 16 denotes a TAB tape holding tool and 17 abonding tool.

[0128] Explanation of the component elements designated by the referencenumerals which have already been mentioned is omitted here.

[0129] After the manufacturing step of FIG. 7A, as shown in FIG. 8A, theTAB tape 4 is fixed to the TAB tape holding tool 16 and held so as toform an interval between the front edge portion of the beam lead 42 andthe bump 6. The interval between the front edge portion of the beam lead42 and the bump 6 and interval between the TAB tape holding tool 16 andthe bump 6 are adjusted in accordance with a stair shape to be formed.For example, if the user wants to form a stair shape such that the TABtape 4 is arranged between the connecting region and the adhesive regionin the vertical direction, the TAB tape holding tool 16 is come intocontact with the bump 6 as close as possible. For example, if the userwants to form the stair shape of the electronic part of FIG. 2, theinterval between the TAB tape holding tool 16 and bump 6 is formed asshown in the embodiment. Further, if the user wants to form theconnecting region and the adhesive region so as to have the same heightin the vertical direction as shown in FIG. 6, it is sufficient to narrowthe interval between the front edge portion of the beam lead 42 and thebump 6 by moving the TAB tape holding tool 16 downward.

[0130] Subsequently, as shown in FIG. 8B, the bonding tool 17 is pressedand moved downward, thereby bonding the front edge portion of the beamlead 42 onto the bump 6. As a bonding, a bonding (thermo-compressionbonding) by using, for example, an ultrasonic wave, heat, or the like isused. At this time, if the bonding tool 17 is pressed, moved downward,and bonded as it is, the beam lead 42 is curved from the portion fixedto the TAB tape holding tool 16 and bonded, so that the beam lead 42 hasthe stair shape as shown in FIG. 5. That is, such a stair shape is ashape which is suitable when the user wants to wire the connectingregion and the adhesive region by the TAB tape 4 longer than theshortest distance. On the other hand, in order to obtain a stair shapeadapted to wire the connecting region and the adhesive region at theshortest distance as shown in FIG. 2 from such a curved stair shape, inthe manufacturing step of adhering the protecting cap 3 and TAB tape 4,which will be explained in FIG. 7C, the TAB tape 4 is adhered whileapplying a tension in the direction of a base edge portion side of thewiring matter, so that such a stair shape can be obtained. However, byusing the stair shape such that the connecting region and the adhesiveregion are wired by the TAB tape 4 longer than the shortest distance,that is, for example, by the TAB tape 4 curved as shown in theembodiment, the stress larger than that in case of the stair shape ofthe TAB tape in FIG. 2 can be lessened. Moreover, since themanufacturing step of applying a tension when the TAB tape is adhered isalso unnecessary, the electronic part can be formed by the small numberof manufacturing steps. Consequently, such a shape can be regarded as amore preferable stair shape.

[0131] Referring to FIG. 8B again, it is preferable that the beam lead42 is exposed in case of connecting by bonding.

[0132] As another method of electrically connecting the TAB tape 4 andbump 6, for example, there is a method of connecting them by ananisotropic conductive film or an anisotropic conductive paste, or thelike. For example, there is a method which the anisotropic conductivefilm, or an anisotropic conductive paste is fed from a needle tip of adispenser to the connecting region of the solid state image pick-upelement chip 1 and TAB tape 4 and coated. In this case, the beam lead 42of the TAB tape 4 is not always necessary to be exposed but theinsulative film 41 can be also formed up to the front edge portion ofthe TAB tape 4. Therefore, since there is no need to add themanufacturing step of exposing the beam lead 42, the whole number ofmanufacturing steps can be reduced.

[0133] As a method other than the dispensing method, for example, theanisotropic conductive film can be also coated by a screen printingmethod or the like.

[0134] The manufacturing steps of the electronic part of the inventionwill be explained with reference to FIGS. 7C to 7E again.

[0135] As shown in FIG. 7C, after completion of the manufacturing stepin FIG. 7B, the adhesive material sheet 8 serving as an adhesivematerial is coated onto the surface (which faces the solid state imagepick-up element chip 1) of the protecting cap 3. In the case where thelight shielding film 7 has been formed on the protecting cap 3 as in theembodiment, the adhesive material sheet 8 can be also coated onto theprotecting cap 3 through the light shielding film 7.

[0136] The adhesive material sheet 8 is made of a thermoplastic resin, athermo-setting resin, or their mixed resin.

[0137] Subsequently, as shown in FIG. 7D, the protecting cap 3 and TABtape 4 are adhered by the adhesive material sheet 8. Upon adhesion, forexample, they can be also thermo-compression bonded. If the thinadhesive material sheet 8 is used as in the embodiment, the thicknessbetween the protecting cap 3 and solid state image pick-up element chip1 of the electronic part can be easily controlled and an overflow of theunnecessary adhesive material can be prevented.

[0138] Further, by fixing them by using the curing-type adhesivematerial, when a mechanical stress is applied from the outside to thewiring member, the stress is received by the adhesive region, so thatthe stress from the outside is hard to be transferred to the connectingregion. Thus, the electrical connection is difficult to be disconnected.

[0139] Finally, as shown in FIG. 7E, the beam lead 42 of the TAB tape 4is covered with the sealing resin 9 as a sealing material lest it isexposed in an area near the connecting region. The sealing resin 9 isalso filled into the gap formed between the connecting region andprotecting cap 3.

[0140] For example, if the TAB tape 4 and solid state image pick-upelement chip 1 are electrically connected by the anisotropic conductivefilm or an anisotropic conductive paste, or the like, it is necessary toform so as to cover the beam lead by the sealing resin 9. This isbecause the electrical connection becomes stable by covering the beamlead by the insulative sealing resin 9.

[0141] The sealing resin 9 has a flexibility and is made of a resin of,for example, the urethane system, silicone system, styrene system, estersystem, vinyl chloride system, epoxy system, or the like.

[0142] Among the foregoing resins, for example, although there is a casewhere the urethane system, epoxy system, or the like is cured byapplying heat and used as an adhesive material, in the embodiment, it isnot cured by the resin in a state where it has the flexibility is usedas a sealing resin 9.

[0143] Further, the sealing resin 9 can be also formed so as to surroundthe whole periphery of the solid state image pick-up element chip 1,that is, so as to seal the outer peripheral portions of the solid stateimage pick-up element chip 1 and protecting cap 3. In this case, theair-tightness among the TAB film 4, solid state image pick-up elementchip 1, and protecting cap 3 is further held.

[0144] In FIGS. 7A and 7B of the embodiment, the manufacturing steps ofFIGS. 7A and 7B are executed in a state where the protecting cap 3 andsolid state image pick-up element chip 1 are preliminarily arranged soas to face each other with a predetermined interval. However, it is alsopossible to construct the manufacturing steps in a manner such that thesolid state image pick-up element chip 1 and protecting cap 3 arearranged lest they face each other, the foregoing manufacturing stepsare executed at places which are away from each other, and thereafter,the surface of the protecting cap 3 where the light shielding film 7 hasbeen formed is allowed to face (with a predetermined interval) thesurface of the solid state image pick-up element chip 1 where the solidstate image pick-up element 2 has been formed. Specifically speaking,the light shielding film 7 is formed onto the protecting cap 3 atdifferent positions. And the solid state image pick-up element 2,electrode pad 5, and bump 6 are formed in the solid state image pick-upelement chip 1. Further, the TAB tape 4 having the stair shape iselectrically connected to the solid state image pick-up element chip 1.After that, the surface of the protecting cap 3 with the light shieldingfilm 7 is allowed to face the surface of the solid state image pick-upelement chip 1 with the solid state image pick-up element 2 at apredetermined interval.

[0145] In the embodiment, although the adhesive material sheet 8 as anadhesive material is coated after the TAB tape 4 had the stair shape, itis also possible to construct in a manner such that at the stage of FIG.7A, that is, at the stage of allowing the protecting cap 3 and solidstate image pick-up element chip 1 to face each other at a predeterminedinterval, the adhesive material sheet 8 has already been coated onto theprotecting cap 3 through the light shielding film 7. It is also possibleto construct in a manner such that the solid state image pick-up elementchip 1 and protecting cap 3 are arranged lest they face each other, theadhesive material sheet 8 is coated onto the protecting cap 3 throughthe light shielding film 7 at different positions, the stair-shaped TABtape 4 is electrically connected to the solid state image pick-upelement chip 1, and thereafter, the surface of the protecting cap 3where the light shielding film 7 has been formed is allowed to face(with a predetermined interval) the surface of the solid state imagepick-up element chip 1 where the solid state image pick-up element 2 hasbeen formed.

[0146] As described above, the manufacturing method of the electronicpart according to the invention includes: the step of electricallyconnecting the wiring member and the functional element chip; the stepof forming the wiring member in a stair shape; and the step of adheringthe wiring member formed in the stair shape onto the protecting memberby using the adhesive material.

[0147] Therefore, the wiring member is adhered to the protecting memberby using the adhesive material while having the stair shape and canlessen the stress which is caused by the difference between thecoefficients of thermal expansion of the protecting member and thefunctional element chip, so that the electronic part in which thefunctional element chip is difficult to be distorted can be provided.

[0148] Moreover, the electronic part in which the electrical connectionbetween the wiring member and the functional element chip is difficultto be disconnected can be provided.

[0149] In addition to the construction such that the wiring member isformed in the stair shape, by wiring the connecting region and theadhesive region by the wiring member longer than the shortest distance,an ability of further lessening the stress which is caused by thedifference between the coefficients of thermal expansion is raised.Thus, the electronic part in which the electrical connection between thewiring member and the functional element chip is more difficult to bedisconnected can be provided.

[0150] On the other hand, since the wiring member and the protectingmember are fixed by using the curing-type and high elastic modulusadhesive material as an adhesive material for adhering them, even if amechanical stress is applied from the outside to the wiring member, thestress is received by the adhesive region of the wiring member and theprotecting member, so that the stress from the outside is nottransferred to the connecting region of the wiring member and thefunctional element chip. Consequently, the electronic part in which theelectrical connection is difficult to be disconnected can be provided.

[0151] By sealing the gap between the functional element chip and theprotecting member by the flexible sealing material, the stress which iscaused by the difference between the coefficients of thermal expansionbetween the functional element chip and the protecting member can bealso lessened by the sealing resin. Thus, the electronic part in whichthe functional element chip is difficult to be distorted can beprovided.

[0152] (Embodiment 7)

[0153]FIG. 9A is a plan view of a solid state image pick-up apparatus asan electronic part according to the embodiment 7 of the invention.

[0154]FIG. 9B is a cross sectional view taken along the broken line9B-9B in FIG. 9A.

[0155]FIG. 9C is a cross sectional view taken along the broken line9C-9C in FIG. 9A.

[0156] In FIGS. 9A and 9C, reference numeral 10 denotes a spacer.

[0157] Explanation regarding the component elements designated by thesame reference numerals as those of the component elements which havealready been described above is omitted here.

[0158] The embodiment 7 differs from the embodiments 1 to 5 with respectto a point that the spacer 10 is formed between the protecting cap 3 andsolid state image pick-up element chip 1.

[0159] The spacer 10 is made of a thermo-setting resin, a thermoplasticresin, or their mixed resin. For example, a resin which is cured byultraviolet rays, heat, or the like, or the like is suitable.

[0160] According to the electronic part of the embodiment, by arrangingthe resin spacer 10 as a spacer into the gap between the protecting cap3 and solid state image pick-up element chip 1, the distance between theprotecting cap 3 and solid state image pick-up element chip 1 isspecified.

[0161] Further, the sealing resin 9 is filled into the gap so as to sealthe outer peripheral portions of the solid state image pick-up elementchip 1 and protecting cap 3. In this case, the air-tightness among theTAB film 4, solid state image pick-up element chip 1, and protecting cap3 is further held.

[0162] It is desirable that the resin spacer 10 is made of the sameresin as the sealing resin 9 or by a resin whose elastic modulus isclose to that of the sealing resin 9 lest the reduction of the stress bythe sealing resin 9 is obstructed while curing the resin. For example,if the sealing resin 9 has a flexibility and is made of a resin of theurethane system, silicone system, styrene system, ester system, vinylchloride system, epoxy system, or the like, it is desirable to use thesame resin or a resin whose elastic modulus is close to that of thesealing resin 9.

[0163] Further, the elastic modulus of the sealing resin 9 is optimizedso as to lessen the thermo-stress which is applied to the solid stateimage pick-up element chip 1. In the embodiment, in case of using theresin having an elastic modulus of, for example, about 150 MPa, it ispreferable that the resin spacer 10 also uses a resin having an elasticmodulus of about 150 MPa.

[0164] As described above, by forming the spacer of the invention intothe gap between the protecting member and the functional element chip ofthe electronic part, a variation of the gap between the protectingmember and the functional element chip which has conventionally been theproblem does not occur but the gap is set to a constant interval, sothat the reliability of the electrical connection of the wiring memberand the functional element chip is assured. Further, since parallelismbetween the protecting member and the functional element chip 1 can beheld, optical characteristics are also improved.

[0165] Since the gap can be assured by the manufacturing steps which aresimpler than those of the conventional method, the cheap electronic parthaving the constant gap can be provided.

[0166] A manufacturing method of the electronic part of the inventionwill now be described.

[0167]FIGS. 10A, 10B, and 10C are schematic cross sectional views forexplaining an outline of the manufacturing method of the electronic partaccording to the invention.

[0168] Explanation regarding the component elements designated by thesame reference numerals as those of the component elements which havealready been described above is omitted here.

[0169] An example of the same solid state image pick-up apparatus asthat shown in FIG. 9C will be described more in detail.

[0170] Specifically speaking, the manufacturing steps of forming theresin spacer 10 as a spacer shown in FIG. 9C will be explained.

[0171] First, as shown in FIG. 10A, the solid state image pick-upelement chip 1 as a functional element chip and the protecting cap 3 asa protecting member 3 are prepared and, further, the solid state imagepick-up element chip 1 and protecting cap 3 are arranged with aninterval.

[0172] Subsequently, the microlens (not shown), the solid state imagepick-up element 2 as a functional element, the electrode pad 5, the bump6, and the like are formed.

[0173] Further, the light shielding film 7 for shielding the light isformed on the surface (of the protecting cap 3) which faces the solidstate image pick-up element chip.

[0174] Subsequently, as shown in FIG. 10B, the resin spacer 10 as aspacer is formed to the protecting cap 3 through the light shieldingfilm 7. The resin spacer 10 is coated with the resin by, for example,the dispensing method or printing method and, thereafter, cured byusing, for instance, ultraviolet rays, heat, or the like. Therefore, theresin spacer 10 can be made of a thermoplastic resin, a thermo-settingresin, or their mixed resin, or can be also made of another arbitraryresin so long as it is cured.

[0175] Moreover, the resin spacer 10 is arranged at a position where itdoes not obstruct the optical characteristics of the solid state imagepick-up element 2. For example, in the embodiment, the resin spacer 10is formed onto the protecting cap 3 through the light shielding film. Inother words, the resin spacer 10 is not formed in a region where thelight enters.

[0176] In the embodiment, the resin spacers 10 are arranged at fourcorners of the solid state image pick-up element chip 1.

[0177] Other examples of arrangement of the resin spacers 10 are shownin FIGS. 11A and 11B, which will be explained hereinlater.

[0178] Finally, as shown in FIG. 10C, the gap between the protecting cap3 and solid state image pick-up element chip 1 is filled with thesealing resin 9 as a sealing material and the insulative film of the TABtape 4 is held by the resin 9.

[0179] If the sealing resin 9 has the flexibility and is made of a resinof, for example, the urethane system, silicone system, styrene system,ester system, vinyl chloride system, epoxy system, or the like, it isdesirable to use the same resin or a resin whose elastic modulus isclose to that of the resin spacers 10.

[0180] Therefore, the elastic modulus of the sealing resin 9 isoptimized so as to lessen the thermo-stress which is applied to thesolid state image pick-up element chip 1. In the embodiment, if theresin having an elastic modulus of, for example, about 150 MPa is used,it is preferable that the resin spacer 10 also uses a resin having anelastic modulus of, for example, about 150 MPa.

[0181] Electronic parts showing other examples of the arrangement of theresin spacers 10 will now be explained with reference to FIGS. 11A and11B.

[0182]FIG. 11A is a plan view of a solid state image pick-up apparatusas an electronic part showing a state where the resin spacers 10 arearranged at six positions in the peripheral portion of the solid stateimage pick-up element chip 1. FIG. 11B is a plan view of a solid stateimage pick-up apparatus as an electronic part showing a state where theresin spacers 10 are arranged, for example, along the sides on the minorside of the solid state image pick-up element chip 1.

[0183] Explanation regarding the component elements designated by thesame reference numerals as those of the component elements which havealready been described above is omitted here.

[0184] First, FIG. 11A will be explained. The resin spacers 10 asspacers are arranged at six positions in the peripheral portion of thesolid state image pick-up element chip 1 as a functional element chip.If it is not requested that the variation of the gap between the solidstate image pick-up element chip 1 and protecting cap 3 is small, it issufficient to improve mass productivity of the solid state image pick-upapparatus by arranging the resin spacers 10 as shown in FIG. 11A.

[0185] On the other hand, if it is strictly requested that the variationof the gap between the solid state image pick-up element chip and theprotecting cap 3 is reduced, it is sufficient to arrange the resinspacers 10 to two minor sides among the four sides of the solid stateimage pick-up element chip 1 as shown in FIG. 11B.

[0186] If the resin spacers 10 are arranged, for example, along thesides on the major side of the solid state image pick-up element chip 1,the variation of the gap can be more strictly reduced than that in caseof arranging the resin spacers 10 to the minor sides. A plurality ofresin spacers 10 can be also arranged with proper intervals. It issufficient to select proper arranging positions or the like inaccordance with the object.

[0187] As described above, the embodiment includes the step of coatingthe resin serving as a spacer onto the gap between the frictionalelement chip 1 and protecting member 3 and, further, the step of curingthe coated resin.

[0188] Consequently, the cheap electronic part in which the gap betweenthe protecting member and the solid state image pick-up element chip ismade constant and the reliability is high and the manufacturing methodof such an electronic part can be provided.

[0189] (Embodiment 8)

[0190]FIG. 12A is a plan view of a solid state image pick-up apparatusas an electronic part according to the embodiment 8 of the invention.

[0191]FIG. 12B is a cross sectional view taken along the broken line12B-12B in FIG. 12A. FIG. 12C is a cross sectional view taken along thebroken line 12C-12C in FIG. 12A.

[0192] Explanation regarding the component elements designated by thesame reference numerals as those of the component elements which havealready been described above is omitted here.

[0193] According to the solid state image pick-up apparatus of theembodiment, although not shown, a reflection preventing film, an opticallow pass filter, or an infrared cutting filter can be solely laminatedonto the protecting cap 3 or they can be combined and laminated thereonas necessary.

[0194] The embodiment 8 is an embodiment in which the resin spacers 10as spacers mentioned in the embodiment 6 are arranged into the solidstate image pick-up apparatus as an electronic part mentioned in theembodiment 4.

[0195] Explaining further in detail hereinbelow, as shown in FIG. 12B,the TAB tape 4 in the embodiment 7 has a stair shape, is electricallyconnected to the solid state image pick-up element chip 1 through thebump 6, and is adhered to the protecting cap 3 by the adhesive materialsheet 8.

[0196] In the embodiment 8, between the connecting region and theadhesive region, the TAB tape 4 has a stair shape and, further, theconnecting region and the adhesive region are wired by the TAB tape 4longer than the shortest distance, thereby lessening the stress which iscaused due to the difference between the coefficients of thermalexpansion of the solid state image pick-up element chip 1 and protectingcap 3. Thus, the solid state image pick-up apparatus in which theelectrical connection of the TAB tape 4 and solid state image pick-upelement chip 1 is difficult to be disconnected can be provided.

[0197] As a stair shape which the TAB tape 4 of the solid state imagepick-up apparatus of the embodiment can have, any of the stair shapesmentioned in the embodiments 1 to 6 can be used.

[0198] In order to make the gap between the protecting cap 3 and solidstate image pick-up element chip 1 constant, the resin spacers 10 arearranged at four positions in the periphery of the solid state imagepick-up element 2, that is, they are arranged in regions where they arenot overlapped with the beam lead 42. Further, they are connected to theprotecting cap 3 through the light shielding member 7 lest the opticalcharacteristics are lost.

[0199] Although the resin spacers 10 are arranged at four positions ofthe solid state image pick-up element chip 1 in the embodiment, it issufficient to select desired arranging positions of the spacers inaccordance with the object as mentioned in the embodiment 7.

[0200] As described above, the electronic part of the embodiment has afeature such that since the wiring member has the stair shape, thefunctional element chip is difficult to be distorted and the electricalconnection between the wiring member and the functional element chip ishard to be disconnected.

[0201] For example, if the wiring member and the protecting member areadhered by using the curing-type adhesive material, even if themechanical stress is applied from the outside to the wiring member, thestress is hard to be transferred to the connecting region of the wiringmember and the functional element chip, so that the electronic part inwhich the electrical connection is difficult to be disconnected can beprovided.

[0202] Further, by arranging the spacers to the gap between theprotecting member and the functional element chip, the gap is madeconstant and the cheap electronic part with high reliability can beprovided.

[0203] A manufacturing method of the electronic part of the embodimentwill now be described.

[0204] An example of the same solid state image pick-up apparatus asthat shown in FIGS. 12A to 12C will be described further in detail.

[0205]FIGS. 13A to 13F show manufacturing steps of the electronic partof the embodiment by using the cross sectional view taken along thebroken line 12C-12C in FIG. 12A.

[0206] Explanation regarding the component elements designated by thesame reference numerals as those of the component elements which havealready been described above is omitted here.

[0207] First, as shown in FIG. 13A, the solid state image pick-upelement chip 1 and protecting cap 3 are prepared and arranged with aninterval.

[0208] Subsequently, the solid state image pick-up element 2 is formedonto the surface (which faces the protecting cap 3) of the solid stateimage pick-up element chip 1 in which the microlens (not shown) has beenformed. Further, the electrode pad 5 is formed into the area whichexists in the same plane as that of the element 2 and in which the solidstate image pick-up element 2 is not formed. Moreover, the bump 6 isformed onto the solid state image pick-up element chip 1 through theelectrode pad 5. As a forming method of the bump 6, for example, a studbump method, a plating method, or the like can be used.

[0209] Subsequently, the light shielding film 7 having a thickness ofabout 30 μm is formed onto the surface (on the side which faces thesolid state image pick-up element chip 1) of the protecting cap 3obtained by cutting, for example, a transparent glass substrate andchamfering the cut surface. The light shielding film 7 for shielding thelight is made of a metal film or resin film. In case of the metal film,the film 7 is formed by using a sputtering method, an evaporationdepositing method, or the like. In case of the resin film, it is formedby using a printing method, a dispensing method, or the like.

[0210] Subsequently, FIG. 13B will be described.

[0211] In the manufacturing step of FIG. 13B, the bump 6 and the beamlead 42 of the TAB tape 4 are electrically connected by an ultrasonicbonding method or the like while having a stair shape. As a method otherthan the ultrasonic bonding method, for example, a bonding by the heator the like (thermo-compression bonding) is considered.

[0212] The TAB tape 4 was formed in a stair shape by using themanufacturing steps in FIGS. 8A and 8B mentioned in the embodiment 6. Asmentioned above, by performing the manufacturing steps in FIGS. 8A and8B, the connecting region and the adhesive region are automaticallywired by the TAB tape 4 longer than the shortest distance.

[0213] As another method of electrically connecting the TAB tape 4 andbump 6, there is a method of connecting them by an anisotropicconductive film or an anisotropic conductive paste, or the like. Forexample, there is a method which the anisotropic conductive film or ananisotropic conductive paste is fed from a needle tip of a dispenser tothe connecting region of the solid state image pick-up element chip 1and TAB tape 4 and coated. In this case, since there is no need to addthe manufacturing step of exposing the beam lead 42, the whole number ofmanufacturing steps can be reduced.

[0214] As a method other than the dispensing method, for example, theanisotropic conductive film can be also coated by a screen printingmethod or the like.

[0215] As shown in FIG. 13C, the resin spacer 10 as a spacer is arrangedbetween the protecting cap 3 and solid state image pick-up element chip1. If the light shielding film 7 is formed on the protecting cap 3 as inthis embodiment, the resin spacer 10 can be also arranged via the lightshielding film 7. For example, the resin is coated onto the protectingcap 3 by, for example, the dispensing method or the printing method, theresin spacer 10 cured by ultraviolet rays, heat, or the like, therebyforming the resin spacer 10. Therefore, it is desirable that the resinspacer 10 is made of a thermo-setting resin, a thermoplastic resin,their mixed resin, or a photo-curing resin.

[0216] Further, in the embodiment, the resin spacers 10 are arranged atpositions where the optical characteristics of the solid state imagepick-up element 2 are not lost. That is, the resin spacers 10 are formedonto the protecting cap 3 through the light shielding film 7. Althoughthe resin spacers 10 are arranged at four corners of the solid stateimage pickup element chip in the embodiment, the arranging positions arenot limited to those positions. Proper arranging positions or the likeof the resin spacers 10 can be selected in accordance with the object,respectively. For example, if the user wants to more strictly reduce thevariation of the gap, the resin spacers 10 can be arranged along thesides on the major side of the solid state image pick-up element chip 1instead of arranging them at four corners as in the embodiment.

[0217] Although the resin serving as resin spacers 10 is coated onto theprotecting cap 3 and subsequently cured in the embodiment, it can bealso coated onto the solid state image pick-up element chip 1 andsubsequently cured.

[0218] The manufacturing steps in FIGS. 13B and 13C can be reversed.That is, after the resin spacers 10 are formed onto the protecting cap3, the TAB tape 4 having the stair shape can be electrically connectedto the solid state image pick-up element chip 1.

[0219] Subsequently, as shown in FIG. 13D, the adhesive material sheet 8as an adhesive material is coated onto the surface of the protecting cap3 which faces the solid state image pick-up element chip. If the lightshielding film 7 was formed on the protecting cap 3 as in theembodiment, the adhesive material sheet 8 can be also coated onto theprotecting cap 3 through the light shielding film 7.

[0220] The adhesive material sheet 8 is made of a thermoplastic resin, athermo-setting resin, or their mixed resin.

[0221] Subsequently, as shown in FIG. 13E, the protecting cap 3 and TABtape 4 are adhered by the adhesive material sheet 8. When adhering, forexample, they can be also thermo-compression bonded. If the thinadhesive material sheet 8 is used as in the embodiment, the thicknessbetween the protecting cap 3 of the electronic part and the solid stateimage pick-up element chip 1 can be easily controlled and the overflowof the unnecessary adhesive material can be prevented.

[0222] Finally, as shown in FIG. 13F, the beam lead 42 of the TAB tape 4is covered with the sealing resin 9 in an area near the connectingportion lest it is exposed. The sealing resin 9 is also filled into thegap formed between the connecting region and the protecting cap 3.

[0223] For example, if the TAB tape 4 and solid state image pick-upelement chip 1 are electrically connected by an anisotropic conductivefilm, an anisotropic conductive paste, or an anisotropic conductiveresin, or the like, it is necessary to form so as to cover the peripheryby the sealing resin 9. This is because by covering it with theinsulative sealing resin 9, the electrical connection becomes stable.

[0224] The sealing resin 9 has flexibility and is made of, for example,the urethane system, silicone system, styrene system, ester system,vinyl chloride system, epoxy system, or the like.

[0225] Further, the sealing resin 9 can be formed so as to surround thewhole periphery of the solid state image pick-up element chip 1, thatis, so as to seal the outer peripheral portions of the solid state imagepick-up element chip 1 and protecting cap 3. In this case, theair-tightness among the TAB film 4, solid state image pick-up elementchip 1, and protecting cap 3 is further held.

[0226] In FIG. 13A of the embodiment, the manufacturing steps of FIGS.13A and 13B as mentioned above are executed in a state where theprotecting cap 3 and solid state image pick-up element chip 1 arearranged so as to face each other with a predetermined interval.However, it is also possible to construct the manufacturing steps in amanner such that the solid state image pick-up element chip 1 andprotecting cap 3 are arranged lest they face each other, the foregoingmanufacturing steps are executed at places which are away from eachother, and thereafter, the surface of the protecting cap 3 where thelight shielding film 7 has been formed is allowed to face (with apredetermined interval) the surface of the solid state image pick-upelement chip 1 where the solid state image pick-up element 2 has beenformed. Specifically speaking, the light shielding film 7 is formed ontothe protecting cap 3 at different positions. And, the solid state imagepick-up element 2, electrode pad 5, and bump 6 are formed in the solidstate image pick-up element chip 1. Further, the TAB tape 4 having thestair shape can be electrically connected to the solid state imagepick-up element chip 1. After that, the surface of the protecting cap 3with the light shielding film 7 is allowed to face the surface of thesolid state image pick-up element chip 1 with the solid state imagepick-up element 2 at a predetermined interval.

[0227] In the embodiment, although the adhesive material sheet 8 as anadhesive material is coated after the TAB tape 4 has the stair shape, atthe stage of FIG. 13A, in a state where the protecting cap 3 and solidstate image pick-up element chip 1 face each other at a predeterminedinterval, the adhesive material sheet 8 can be preliminarily coated ontothe protecting cap 3 through the light shielding film 7. It is alsopossible to construct in a manner such that the solid state imagepick-up element chip 1 and protecting cap 3 are arranged lest they faceeach other, at different positions, the adhesive material sheet 8 iscoated onto the protecting cap 3 through the light shielding film 7, thestair-shaped TAB tape 4 is electrically connected to the solid stateimage pick-up element chip 1, and thereafter, the surface of theprotecting cap 3 having the light shielding film 7 is allowed to face(with a predetermined interval) the surface of the solid state imagepick-up element chip 1 having the solid state image pick-up element 2.

[0228] Further, since the wiring member and the protecting member arefixed by using the curing-type and high elastic modulus adhesivematerial as an adhesive material for adhering them, even if a mechanicalstress is applied from the outside to the wiring member, the stress isreceived by the adhesive region of the wiring member and the protectingmember, so that the stress from the outside is not transferred to theconnecting region of the wiring member and the functional element chip.Consequently, the electronic part in which the electrical connection iseven more difficult to be disconnected can be provided.

[0229] As described above, the manufacturing method of the electronicpart according to the invention includes: the step of electricallyconnecting the wiring member and the functional element chip; the stepof forming the wiring member in a stair shape; the step of adhering thewiring member formed in the stair shape onto the protecting member byusing the adhesive material; the step of coating the resin serving as aspacer between the functional element chip and the protecting memberonto the protecting member or the functional element chip; and the stepof curing the coated resin.

[0230] Therefore, since the wiring member having the stair shape iselectrically connected to the functional element chip, the stress whichis caused by the difference between the coefficients of thermalexpansion can be lessened by such a stair shape. Further, since the gapbetween the functional element chip and the protecting member is madeconstant by the spacer, the electronic part which is strong against thestress and the stress from the outside can be provided by thecost-effective manufacturing method with high reliability. Further, byadhering the wiring member to the protecting member by using thecuring-type adhesive material, the structure in which the stress fromthe outside is difficult to be transferred to the connecting region ofthe functional element chip and the wiring member can be obtained.

[0231] In each of the embodiments of the invention, a semiconductorphotosensitive element such as a photodiode, a semiconductor lightemitting element such as an LED, an element such as a micromirror, orthe like can be used as a functional element. Therefore, a lightemitting element chip such as LED or FED, a light modulation elementchip such as a DMD, or the like can be used as a functional element chipother than the solid state image pick-up element chip. In the solidstate image pick-up element chip, the photosensitive surface of the chipon which the semiconductor photosensitive element has been formedbecomes the light operational surface. In the light emitting elementchip or DMD, the light emitting surface or reflecting surface of thechip becomes the light operational surface.

[0232] (Embodiment 9)

[0233]FIG. 14 is a constructional diagram of a solid state image pick-upsystem using the solid state image pick-up apparatus as an electronicpart of the invention.

[0234] In FIG. 14, reference numeral 1001 denotes a barrier serving as alens protecting device and a main switch; 1002 a lens for forming anoptical image of an object to be photographed onto a solid state imagepick-up element 1004; 1003 a diaphragm for varying an amount of lighttransmitted through the lens; 1004 the solid state image pick-up elementwhich is used for fetching the image of the photographing object formedby the lens 1002 as an image signal and which has 1007 already beendescribed; 1005 an image pick-up signal processing unit of executingvarious processes such as correction, clamping, and the like to theimage signal which is outputted from the solid state image pick-upelement 1004; 1006 an A/D converter for analog/digital converting theimage signal outputted from the solid state image pick-up element 1004;1007 a signal processing unit of performing various correcting processesto the image data outputted from the A/D converter 1006 or compressingthe data; 1008 a timing generator of generating various timing signalsto the solid state image pick-up element 1004, image pick-up signalprocessing circuit 1005, A/D converter 1006, and signal processing unit1007, respectively; 1009 a unit of executing various arithmeticoperations and controlling the whole still video camera; 1010 a memoryunit for temporarily storing the image data; 1011 a recording mediumcontrol interface (I/F) unit for recording or reading the image dataonto/from a recording medium; 1012 a detachable recording medium such asa semiconductor memory or the like to/from which the image data isrecorded or read out; and 1013 an external interface (I/F) unit ofcommunicating with an external computer or the like.

[0235] Subsequently, the operation of the system of FIG. 14 will bedescribed. When the barrier 1001 is opened, a main power source isturned on, a power source of a control system is turned on, and further,a power source of an image pick-up system circuit such as an A/Dconverter 1006 and the like is turned on. After that, in order tocontrol an exposure amount, the unit 1009 opens the diaphragm 1003. Asignal outputted from the solid state image pick-up element 1004 passesthrough the image pick-up signal processing unit 1005 and is outputtedto the A/D converter 1006. The A/D converter 1006 A/D converts thesignal and outputs the converted digital signal to the signal processingunit 1007. The signal processing unit 1007 arithmetically operates theexposure amount on the basis of the data by the unit 1009.

[0236] The brightness is determined on the basis of a result of aphotometric operation. In accordance with the resultant brightness, theunit 1009 controls the diaphragm. Subsequently, on the basis of thesignal outputted from the solid state image pick-up element 1004, highfrequency components are extracted and a distance to the object iscalculated by the unit 1009. After that, the lens 1002 is driven andwhether the lens is in an in-focus state or not is discriminated. If itis determined that the lens is in an out-of-focus state, the lens 1002is driven and the distance is measured again.

[0237] After the in-focus state is confirmed, the actual exposure isstarted. When the exposure is finished, the image signal outputted fromthe solid state image pick-up element 1004 is subjected to thecorrection or the like by the image pick-up signal processing unit 1005.The signal is further A/D converted by the A/D converter 1006. Theconverted digital signal passes through the signal processing unit 1007and stored into the memory unit 1010 by the unit 1009. After that, thedata stored in the memory unit 1010 passes through the recording mediumcontrol I/F unit 1011 by the control of the unit 1009 and recorded ontothe detachable recording medium 1012 such as a semiconductor memory orthe like. It is also possible to transmit the data passes through theexternal I/F unit 1013, directly input it to the computer or the like,and process an image.

What is claimed is:
 1. An electronic part comprising: a functionalelement chip on which a functional element has been formed; a wiringmember which is electrically connected to said functional element chip;and a protecting member for protecting said functional element chip,wherein said wiring member has a stair shape and is electricallyconnected to said functional element chip.
 2. A part according to claim1, wherein said wiring member and said protecting member are adheredwith an adhesive material.
 3. A part according to claim 2, wherein saidelectronic part has a connecting region in which said wiring member andsaid functional element chip are electrically connected and an adhesiveregion in which said wiring member and said protecting member areadhered, and when a surface of said functional element chip on whichsaid functional element has been formed is assumed to be a reference ofa height, the connecting region of said wiring member and the adhesiveregion of said wiring member are formed so as to have different heights.4. A part according to claim 2, wherein said electronic part has aconnecting region in which said wiring member and said functionalelement chip are electrically connected and an adhesive region in whichsaid wiring member and said protecting member are adhered, and a lengthof the wiring member connecting said connecting region and said adhesiveregion is longer than a shortest distance between said connecting regionand said adhesive region.
 5. A part according to claim 2, wherein saidelectronic part has a connecting region in which said wiring member andsaid functional element chip are electrically connected and an adhesiveregion in which said wiring member and said protecting member areadhered, and said adhesive region is formed on a base edge portion sideof said wiring member closer than said connecting region.
 6. A partaccording to claim 2, wherein said adhesive material has a sheet shape,and after said adhesive material is attached by temporarilycompression-bonding it onto said protecting member, said wiring memberis thermo-compression bonded, thereby adhering said wiring member andsaid protecting member.
 7. A part according to claim 2, wherein saidadhesive material is made of a thermoplastic resin, a thermo-settingresin, or a mixed resin of said thermoplastic resin and saidthermo-setting resin.
 8. A part according to claim 2, further comprisinga sealing material for sealing said functional element chip and saidprotecting member.
 9. A part according to claim 8, wherein an elasticmodulus of said sealing material is lower than that of said adhesivematerial.
 10. A part according to claim 8, wherein an elastic modulus ofsaid sealing material is equal to or lower than 300 MPa.
 11. A partaccording to claim 2, wherein said functional element chip is a solidstate image pick-up element chip, a light emitting element chip, or alight modulating element chip.
 12. A part according to claim 2, whereinsaid protecting member protects said functional element on anoperational surface side of said functional element chip and istransparent.
 13. A part according to claim 2, wherein in said protectingmember, a light shielding member for shielding light is formed at leastin a part of a surface which faces said functional element chip.
 14. Apart according to claim 2, wherein said protecting member has at leastone of a reflection preventing film, an optical low pass filter, and aninfrared cutting filter.
 15. A part according to claim 2, wherein aspacer is arranged between said functional element chip and saidprotecting member.
 16. A part according to claim 15, wherein said spaceris arranged in a region where the functional element is not formed. 17.A part according to claim 15, wherein after a thermoplastic resin, athermo-setting resin, or their mixed resin is coated, it is cured byultraviolet rays, heat, or the like, thereby forming said spacer.
 18. Amanufacturing method of an electronic part having a functional elementchip on which a functional element has been formed, a wiring memberwhich is electrically connected to said functional element chip, and aprotecting member for protecting said functional element chip,comprising the steps of: electrically connecting said functional elementchip and said wiring member; and adhering said protecting member to saidwiring member with an adhesive material so as to have a stair shape. 19.A method according to claim 18, wherein said step of adhering saidwiring member to said protecting member further has a step of wiring aconnecting region in which said functional element chip and said wiringmember are connected and an adhesive region in which said protectingmember and said wiring member are adhered by a wiring member longer thana shortest distance between them.
 20. A method according to claim 18,wherein in said step of adhering said wiring member to said protectingmember, they are adhered, as a tension is applied to said wiring memberin the direction of a base edge portion side of said wiring member. 21.A method according to claim 18, further comprising the step of sealing agap between said functional element chip and said protecting member by asealing material.
 22. A method according to claim 18, further comprisingthe step of forming a layer serving as a light shielding member onto asurface of said protecting member which faces said functional elementchip.
 23. A method according to claim 18, further comprising the stepsof: coating a resin serving as a spacer in a gap between said protectingmember and said functional element chip onto said protecting member orsaid functional element chip; and curing said coated resin.
 24. A methodaccording to claim 23, wherein said resin is a thermo-setting resin. 25.A method according to claim 23, wherein said resin is a photo-curingresin.
 26. An electronic part comprising: a functional element chip inwhich a functional element has been formed; and a protecting member forprotecting said functional element chip, wherein a spacer is arrangedbetween said functional element chip and said protecting member.
 27. Apart according to claim 26, wherein said spacer is made of athermoplastic resin, a thermo-setting resin, their mixed resin, or aphoto-curing resin.
 28. A part according to claim 27, wherein saidspacer is formed in a region of said functional element chip on whichsaid functional element is not formed.
 29. A part according to claim 26,further having a sealing material for sealing said functional elementchip and said protecting member.
 30. A part according to claim 29,wherein said sealing material and said spacer are made of a same resinor resins whose elastic modulus are close.
 31. A part according to claim26, wherein said functional element chip is a solid state image pick-upelement chip, a light emitting element chip, or a light modulatingelement chip.
 32. A part according to claim 26, wherein said protectingmember protects said functional element on an operational surface sideof said functional element chip and is transparent.
 33. A part accordingto claim 26, wherein in said protecting member, a light shielding memberfor shielding light is formed at least in a part of a surface whichfaces said functional element chip.
 34. A part according to claim 26,wherein said protecting member has at least one of a reflectionpreventing film, an optical low pass filter, and an infrared cuttingfilter.
 35. A manufacturing method of an electronic part having afunctional element chip in which a functional element has been formed,and a protecting member for protecting said functional element chip,comprising the steps of: coating a resin serving as a spacer onto saidfunctional element chip or said protecting member; and curing saidcoated resin.
 36. A method according to claim 35, wherein said resin isa thermo-setting resin.
 37. A method according to claim 35, wherein saidresin is a photo-curing resin.
 38. A method according to claim 35,wherein the step of arranging the spacer into a gap between saidfunctional element chip and said protecting member includes a step offorming said spacer into a portion where said functional element is notformed.
 39. A method according to claim 35, further comprising the stepof sealing a gap between said functional element chip and saidprotecting member by a sealing material.
 40. A method according to claim39, wherein in said step of curing said spacer, said spacer is cured soas to have an elastic modulus which is close to that of said sealingmaterial.
 41. An electronic part comprising: a functional element chipin which a functional element has been formed; a wiring member which iselectrically connected to said functional element chip; and a protectingmember for protecting said functional element chip, wherein said wiringmember has an adhesive region adhered to said protecting member by anadhesive material and a connecting region electrically connected to saidfunctional element chip, and said adhesive region is formed on a baseedge portion side of said wiring member closer than said connectingregion.
 42. A part according to claim 41, wherein said adhesive materialhas a sheet shape, and after said adhesive material is attached bytemporarily compression-bonding it onto said protecting member, saidwiring member is thermo-compression bonded, thereby adhering said wiringmember and said protecting member.
 43. A part according to claim 41,wherein said adhesive material is made of a thermoplastic resin, athermo-setting resin, or a mixed resin of said thermoplastic resin andsaid thermo-setting resin.
 44. A part according to claim 41, furthercomprising a sealing material for sealing said functional element chipand said protecting member.
 45. A part according to claim 44, wherein anelastic modulus of said sealing material is lower than that of saidadhesive material.
 46. A part according to claim 44, wherein an elasticmodulus of said sealing material is equal to or lower than 300 MPa. 47.A part according to claim 41, wherein said functional element chip is asolid state image pick-up element chip, a light emitting element chip,or a light modulating element chip.
 48. A part according to claim 41,wherein said protecting member protects said functional element on anoperational surface side of said functional element chip and istransparent.
 49. A part according to claim 41, wherein in saidprotecting member, a light shielding member for shielding light isformed at least in a part of a surface which faces said functionalelement chip.
 50. A part according to claim 41, wherein said protectingmember h as at least one of a reflection preventing film, an optical lowpass filter, and an infrared cutting filter.
 51. A part according toclaim 41, wherein a spacer is arranged between said functional elementchip and said protecting member.
 52. A part according to claim 51,wherein said spacer is arranged in a region where the functional elementis not formed.
 53. A part according to claim 51, wherein after athermo-setting resin, a thermoplastic resin, or their mixed resin iscoated, it is cured by ultraviolet rays, heat, or the like, therebyforming said spacer.